Nishimura, T <br/><br/>
Nickel-Stabilized Hexagonal (Cu, Ni)6sn5 in Sn-Cu-Ni Lead-Free Solder Alioys 

 - 191-194 p. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Intermetalilc Compound<br/>Solder Joint Reliability<br/>Transmission Electron Microscopy