TY  - BOOK
AU  - Moore, Thomas M.
AU  - Mckenna, Robert G.
TI  - Characterization of Integrated Circuit Packaging Materials 
SN  - 0750692677
U1  - 621.381046 
PY  - 1993///
CY  - Boston : 
PB  - Butterworth-Heinemann, 
KW  - Electronic Packaging Materials
KW  - Integrated Circuits Design and Construction
N1  - NN
UR  - https://eaklibrary.neduet.edu.pk:8443/catalog/bk/books/toc/0-7506-9267-7.pdf
ER  -