Moore, Thomas M. <br/><br/>
Characterization of Integrated Circuit Packaging Materials  

 - Boston :   Butterworth-Heinemann,   c1993 
 - XVIII, 274 p. 
 - Materials Characterization Series .
<br/><br/>
<br/><br/><label>ISBN: </label>0750692677 
<br/><br/><label>ISSN: </label>
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic Packaging Materials<br/>Integrated Circuits Design and Construction
<br/><br/><label>Dewey Class. No.: </label>621.381046  / MOO