TY  - BOOK
AU  - Tummala, Rao R.
AU  - Klopfenstein, Alan G.
AU  - Rymaszewski, Eugene J.
TI  - Microelectronics Packaging Handbook 
SN  - 0412084317
U1  - 621.38102 
PY  - 1997///
CY  - New York : 
PB  - Chapman and Hall, 
KW  - Microelectronic Packaging Handbooks Manuals
N1  - YY; Pt. 1. Technolog Drivers
UR  - https://eaklibrary.neduet.edu.pk:8443/catalog/bk/books/toc/0-412-08431-7.pdf
ER  -