Hsu, Tai-Ran <br/><br/>
Mems Packaging  

 - London :   Inspec/The Institution of Electrical Engineers,   c2004 
 - XXIX, 275 p.  : ill 
 - Emis Processing Series ; No. 3 .
<br/><br/>Includes Bibliographical References and Index 
<br/><br/><label>ISBN: </label>0863413358 
<br/><br/><label>ISSN: </label>
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical Systems<br/>Microelectronic Packaging
<br/><br/><label>Dewey Class. No.: </label>621.381  / HSU