Extensions OfClosed Form Method for Substrale Thermal Analyzers to Include Thermal Resistances from Source-To-Substrate and Source to Ambient

By: Material type: ArticleArticleDescription: 658-666 pSubject(s): In: IEEE Transactions on Components Hybrids and Manufacturing Technology
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.15, No.05 (Oct. 1992) Available

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