Chatacterization of Self-Heating in Advanced Vlsi Interconnect lines Based on Thermal Finite Element Simulation

By: Material type: ArticleArticleDescription: 406-411 pSubject(s): In: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.21, No.03 (Sep. 1998) Available

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