A Reliable and Environmentaliy Friendly Packaging Technology Flip Chip Joining Using Anisotropicaliy Conductive Adhesive

By: Material type: ArticleArticleDescription: 186-190 pSubject(s): In: IEEE Transactions on Components and Packaging Technologies
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.22, No.02 (Jun. 1999) Available