Finite Element Analysis for Grinding of Wire-Sawn Silicon Wafers: A Designed Experiment (Record no. 769515)

MARC details
000 -LEADER
fixed length control field 00453nab a2200121Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2003 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Pei, Z J
9 (RLIN) 801227
245 #0 - TITLE STATEMENT
Title Finite Element Analysis for Grinding of Wire-Sawn Silicon Wafers: A Designed Experiment
300 ## - PHYSICAL DESCRIPTION
Extent 07-16 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Finite Element
9 (RLIN) 169884
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2003
Title International Journal of Machine tools & Manufacture: Design, Research and Application
International Standard Serial Number 08906955
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.43, No.01 (Jan. 2003)   19/08/2023 Articles