The Effect of Pulse Plating Parameters on Copper Plating Distribution of Microvia Pcb Manufacture (Record no. 764046)

MARC details
000 -LEADER
fixed length control field 00471nab a2200133Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2003 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Yung, K C
9 (RLIN) 811370
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Yu, T.M
9 (RLIN) 781770
245 #4 - TITLE STATEMENT
Title The Effect of Pulse Plating Parameters on Copper Plating Distribution of Microvia Pcb Manufacture
300 ## - PHYSICAL DESCRIPTION
Extent 106-109 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Printed Circuit Board
9 (RLIN) 710909
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2003
Title Ieee Transactions onElectronics Packaging Manufacturing
International Standard Serial Number 1523334X
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.26, No.02 (Apr. 2003)   19/08/2023 Articles