The Effect of Pulse Plating Parameters on Copper Plating Distribution of Microvia Pcb Manufacture (Record no. 764046)
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000 -LEADER | |
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fixed length control field | 00471nab a2200133Ia 4500 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 230808s2003 |||||||f |||| 00| 0 eng d |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Yung, K C |
9 (RLIN) | 811370 |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Yu, T.M |
9 (RLIN) | 781770 |
245 #4 - TITLE STATEMENT | |
Title | The Effect of Pulse Plating Parameters on Copper Plating Distribution of Microvia Pcb Manufacture |
300 ## - PHYSICAL DESCRIPTION | |
Extent | 106-109 p. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Printed Circuit Board |
9 (RLIN) | 710909 |
773 ## - HOST ITEM ENTRY | |
Place, publisher, and date of publication | 2003 |
Title | Ieee Transactions onElectronics Packaging Manufacturing |
International Standard Serial Number | 1523334X |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | Articles |
-- | 51 |
-- | ABUL KALAM Library |
Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
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Engr Abul Kalam Library | Vol.26, No.02 (Apr. 2003) | 19/08/2023 | Articles |