Bond Wireless Multichip Packaging Technology for High-Speed Circuits (Record no. 750424)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00571nab a2200169Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230808s1992 |||||||f |||| 00| 0 eng d |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Mahoney, Leonard J. |
| 9 (RLIN) | 791846 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Chen, Chang-Lee |
| 9 (RLIN) | 791847 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Tsang, Dean Z. |
| 9 (RLIN) | 791849 |
| 245 #0 - TITLE STATEMENT | |
| Title | Bond Wireless Multichip Packaging Technology for High-Speed Circuits |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 451-456 p. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Wireless |
| 9 (RLIN) | 92193 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Bond |
| 9 (RLIN) | 169281 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Multichip Package |
| 9 (RLIN) | 788748 |
| 773 ## - HOST ITEM ENTRY | |
| Place, publisher, and date of publication | 1992 |
| Title | IEEE Transactions on Components Hybrids and Manufacturing Technology |
| International Standard Serial Number | 01486411 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Articles |
| -- | 51 |
| -- | ABUL KALAM Library |
| Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
|---|---|---|---|---|---|
| Engr Abul Kalam Library | Vol.15, No.04 (Aug. 1992) | 19/08/2023 | Articles |