A New Packaging Technology Using Micro-Solder Bumps for High-Speed Photoreceivers (Record no. 750114)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00609nab a2200169Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230808s1992 |||||||f |||| 00| 0 eng d |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Hayashi, Tsuyoshi |
| 9 (RLIN) | 791274 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Katsura, Kohsuke |
| 9 (RLIN) | 791276 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Tsunetsugu, Hideki |
| 9 (RLIN) | 776583 |
| 245 #2 - TITLE STATEMENT | |
| Title | A New Packaging Technology Using Micro-Solder Bumps for High-Speed Photoreceivers |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 578-582 p. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Packaging Technology |
| 9 (RLIN) | 791278 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Bumps |
| 9 (RLIN) | 778660 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | High-Speed Photoreceivers |
| 9 (RLIN) | 791281 |
| 773 ## - HOST ITEM ENTRY | |
| Place, publisher, and date of publication | 1992 |
| Title | IEEE Transactions on Components Hybrids and Manufacturing Technology |
| International Standard Serial Number | 01486411 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Articles |
| -- | 51 |
| -- | ABUL KALAM Library |
| Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
|---|---|---|---|---|---|
| Engr Abul Kalam Library | Vol.15, No.04 (Aug. 1992) | 19/08/2023 | Articles |