Model and Analyses for Solder Reflow Cracking Phenomenon in Smt Plastic Packages (Record no. 748800)

MARC details
000 -LEADER
fixed length control field 00550nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1993 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Ganesan, Gams S.
9 (RLIN) 788693
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Berg, Howard M.
9 (RLIN) 788695
245 #0 - TITLE STATEMENT
Title Model and Analyses for Solder Reflow Cracking Phenomenon in Smt Plastic Packages
300 ## - PHYSICAL DESCRIPTION
Extent 940-948 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Model and Analysis
9 (RLIN) 780158
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Smt
9 (RLIN) 788697
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Package Modeling
9 (RLIN) 767703
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1993
Title IEEE Transactions on Components Hybrids and Manufacturing Technology
International Standard Serial Number 01486411
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.16, No.08 (Dec. 1993)   19/08/2023 Articles
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