High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages (Record no. 748740)
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000 -LEADER | |
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fixed length control field | 00546nab a2200157Ia 4500 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 230808s1990 |||||||f |||| 00| 0 eng d |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Iwase, Nobuo |
9 (RLIN) | 788594 |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Tsuge, Akihiko |
9 (RLIN) | 718488 |
245 #0 - TITLE STATEMENT | |
Title | High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages |
300 ## - PHYSICAL DESCRIPTION | |
Extent | 313-319 p. |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Thermal Conductivity |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Aluminum Nitride |
9 (RLIN) | 738735 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name entry element | Ceramic Substrates |
9 (RLIN) | 788598 |
773 ## - HOST ITEM ENTRY | |
Place, publisher, and date of publication | 1990 |
Title | IEEE Transactions on Components Hybrids and Manufacturing Technology |
International Standard Serial Number | 01486411 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | Articles |
-- | 51 |
-- | ABUL KALAM Library |
Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
---|---|---|---|---|---|
Engr Abul Kalam Library | Vol.13, No.02 (Jun. 1990) | 19/08/2023 | Articles |