High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages (Record no. 748740)

MARC details
000 -LEADER
fixed length control field 00546nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1990 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Iwase, Nobuo
9 (RLIN) 788594
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Tsuge, Akihiko
9 (RLIN) 718488
245 #0 - TITLE STATEMENT
Title High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages
300 ## - PHYSICAL DESCRIPTION
Extent 313-319 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Thermal Conductivity
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Aluminum Nitride
9 (RLIN) 738735
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Ceramic Substrates
9 (RLIN) 788598
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1990
Title IEEE Transactions on Components Hybrids and Manufacturing Technology
International Standard Serial Number 01486411
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.13, No.02 (Jun. 1990)   19/08/2023 Articles
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