Study onPressurized Underfili Encapsulation of Flip Chips (Record no. 745948)

MARC details
000 -LEADER
fixed length control field 00545nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1997 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Han, Sejin
9 (RLIN) 777391
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Wang, K. K.
9 (RLIN) 694663
245 #0 - TITLE STATEMENT
Title Study onPressurized Underfili Encapsulation of Flip Chips
300 ## - PHYSICAL DESCRIPTION
Extent 434-442 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Encapsulant
9 (RLIN) 769985
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip-Chip
9 (RLIN) 765290
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Pressurized Flow
9 (RLIN) 782100
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1997
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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  Engr Abul Kalam Library Vol.20, No.04 (Nov. 1997)   19/08/2023 Articles
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