A Closed Form Solution of Junction to Substrate Thermal Resistance in Semiconductor Chips (Record no. 742031)

MARC details
000 -LEADER
fixed length control field 00539nab a2200145Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1996 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Masana, Francesc N.
9 (RLIN) 772783
245 #2 - TITLE STATEMENT
Title A Closed Form Solution of Junction to Substrate Thermal Resistance in Semiconductor Chips
300 ## - PHYSICAL DESCRIPTION
Extent 539-545 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Thermal Resistance
9 (RLIN) 725727
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Heat Spreading
9 (RLIN) 766326
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Spreading Rate
9 (RLIN) 707833
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1996
Title IEEE Transactions on Components Packaging and Manufacturing Technology Part A
International Standard Serial Number 10709886
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.19, No.04 (Dec. 1996)   19/08/2023 Articles
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