Effective Elastic Modulus of Underfili Material for Flip-Chip Applications (Record no. 741293)

MARC details
000 -LEADER
fixed length control field 00523nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2002 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Qu, Jianmin
9 (RLIN) 770949
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Wong, C. P.
9 (RLIN) 93201
245 #0 - TITLE STATEMENT
Title Effective Elastic Modulus of Underfili Material for Flip-Chip Applications
300 ## - PHYSICAL DESCRIPTION
Extent 53-65 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Effective Width
9 (RLIN) 170751
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip-Chip
9 (RLIN) 765290
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Micromechanics
9 (RLIN) 102923
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2002
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.25, No.01 (Mar. 2002)   19/08/2023 Articles
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