Characterization of Underfili Materials Foer Functional Solder Bumped Flip Chips on Board Applications (Record no. 740927)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00546nab a2200157Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230808s1999 |||||||f |||| 00| 0 eng d |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Lau, John H. |
| 9 (RLIN) | 5010 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Chang, Chris |
| 9 (RLIN) | 770033 |
| 245 #0 - TITLE STATEMENT | |
| Title | Characterization of Underfili Materials Foer Functional Solder Bumped Flip Chips on Board Applications |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 111-119 p. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Flip Chip |
| 9 (RLIN) | 765290 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Pcb |
| 9 (RLIN) | 730622 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Underfili Processing |
| 9 (RLIN) | 768371 |
| 773 ## - HOST ITEM ENTRY | |
| Place, publisher, and date of publication | 1999 |
| Title | IEEE Transactions on Components and Packaging Technologies |
| International Standard Serial Number | 15213331 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Articles |
| -- | 51 |
| -- | ABUL KALAM Library |
| Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
|---|---|---|---|---|---|
| Engr Abul Kalam Library | Vol.22, No.01 (Mar. 1999) | 19/08/2023 | Articles |