Normal view MARC view ISBD view

Bonding Mechanism Between Aluminum Nitride Substrate and Ag-Cu-Ti Solder

Kurihara, Yasutoshi Takahashi, Shigeru

Bonding Mechanism Between Aluminum Nitride Substrate and Ag-Cu-Ti Solder - 361-368 p.

Subjects--Topical Terms:
Bonding
Aluminum Nitride
Damage Mechanisms

Print
Request article
Suggest for purchase
Send to device
Save record
BIBTEX Dublin Core ISBD MARCXML RIS
More searches

Search for this title in:
Other Databases (Google Scholar) Open Library (openlibrary.org) Pakistan Union Catalogue (pastic.gov.pk) Other Libraries (WorldCat)