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3-D Electromagnetic Field Analysis of Interconnections in Copper-Polyimide Multichip Modules

Sasaki, Shin-Ichi Ohsaki, Takaaki

3-D Electromagnetic Field Analysis of Interconnections in Copper-Polyimide Multichip Modules - 755-760 p.

Subjects--Topical Terms:
Electromagnetic Fields
Interconnections
Copper-Polyimide

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