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Thermal limits of Flip Chip Package Experimentaliy Valisated Cfd Supported Case Studies

Tom Lee, Tien-Yu Mahalingam, Mali

Thermal limits of Flip Chip Package Experimentaliy Valisated Cfd Supported Case Studies - 94-103 p.

Subjects--Topical Terms:
Thermal Resistance
Computational Fluid Dynamics (Cfd)
Thermal liquefaction

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