Substrate Temperatures of liquid Nitrogen Cooled Multichip Modules Utlizing Wirebonded Die
Ulrich, Richard K. Rajan, Sanjay
Substrate Temperatures of liquid Nitrogen Cooled Multichip Modules Utlizing Wirebonded Die - 827-834 p.
Superconductor
Mcm
Thermal Management
Substrate Temperatures of liquid Nitrogen Cooled Multichip Modules Utlizing Wirebonded Die - 827-834 p.
Superconductor
Mcm
Thermal Management