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Effects of Silica Filier and Diuent on Material Properties and Reliability of Nonconductive Pastes (Ncps) for Flip-Chip Applications

Jang, Kyung-Woon Kwon, Woon-Seong

Effects of Silica Filier and Diuent on Material Properties and Reliability of Nonconductive Pastes (Ncps) for Flip-Chip Applications - 608-615 p.

Subjects--Topical Terms:
Diluent
Filier Size
Thermal Cycle Stability

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