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Exothermic Reaction Induced Eutectic Pb-Sn Solder Bali Melting InUnderfili Curing Process

Kwon, Woon-Seong Jang, Se-Young Paik, Kyung-Wook

Exothermic Reaction Induced Eutectic Pb-Sn Solder Bali Melting InUnderfili Curing Process - 172-174 p.

Subjects--Topical Terms:
Exotherm
Flip Chip
Solder Bali Reliability

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