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Study OfFluxing Agent Effects onProerties of No-Flow Underfili Materials for Flip-Chip Applications

Shi, S. H. Wong, C. P.

Study OfFluxing Agent Effects onProerties of No-Flow Underfili Materials for Flip-Chip Applications - 141-151 p.

Subjects--Topical Terms:
Catalyst
Epoxy
Flip-Chip

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