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Wetting andReaction of Multiwalied Carbon Nanotube- Reinforced Composite Solder with a Copper Substrate

Huang, Her- Yueh Yang, Chung- Wei Pan, Sian- Ze

Wetting andReaction of Multiwalied Carbon Nanotube- Reinforced Composite Solder with a Copper Substrate - 301-306 p.

Subjects--Topical Terms:
Composite Solder
Contact Angle
Intermetalilc Compound

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