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Mems Packaging

Hsu, Tai-Ran

Mems Packaging - London : Inspec/The Institution of Electrical Engineers, c2004 - XXIX, 275 p. : ill - Emis Processing Series ; No. 3 .

Includes Bibliographical References and Index

ISBN: 0863413358

ISSN:

Subjects--Topical Terms:
Microelectromechanical Systems
Microelectronic Packaging

Dewey Class. No.: 621.381 / HSU

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